Yield Engineering Systems

Ramakanth Alapati, Chairman & CEO, Yield Engineering Systems (YES) and Vinod Subramanian, Vice President, Invest India, sat down for an insightful fireside chat on YES’s growing presence in India’s semiconductor landscape. See the full conversation at: https://xmrrwallet.com/cmx.plnkd.in/gXP8syKS

YES Delivers Multiple VertaCure LX Systems - These systems will be used in advanced semiconductor packaging for AI and high-performance computing, supporting low-temperature curing and annealing for next-gen Edge devices. https://xmrrwallet.com/cmx.plnkd.in/gWfYuQnJ

SURE Wet Processing tool by YES is versatile and capable of running multiple chemical processes for either R&D or volume manufacturing. Discover the many capabilities of SURE at https://xmrrwallet.com/cmx.plnkd.in/gPN63SaJ #AdvancedPackaging #SemiconductorEquipment #SemiconductorManufacturing #WaferProcessing #PanelProcessing #YES 

ECTC 2025, insightful discussion with Industry experts on Glass Core vs RDL Interposers, with standing room only. Zia Karim, E. Jan Vardaman

Dr. Zia Karim, YES CTO will co-chair a special session on ‘Glass Core vs RDL Interposers: Ready for Prime-Time?’. Please join us on Tuesday May 27th 10:30am-12:00pm in Hall – Texas 1-3

Please join us at ECTC 2025, Session 16 on May 29th at 10:10am in Hall - Texas 1-3. Xinxuan Tan, Sr. Process Engineer at YES will discuss ‘Improving the Quality and Yield performance of Vacuum Fluxless Reflow Soldering for High-density AI chips’. Xinxuan Tan, Lei J., Zia Karim, Ramakanth Alapati, Nirmalya Maity, Sai Prashanth Dhanraj, Saket Chadda, Rezwan Lateef

Russ Sanchez, YES VP of Supply Chain and Quality will join Barry O'Dowd, Joe Cestari and Julia Freer to discuss building resilient operations, driving real sustainability, and preparing for the future with new tools and technologies involving AI and other digital platforms. Learn how manufacturers and logistics experts are fortifying supply chains against disruption, capacity issues, and bottlenecks using proactive strategies. Register here: https://xmrrwallet.com/cmx.plnkd.in/g7yn8BDJ

The VertaCure family of tools are engineered to streamline and elevate advanced packaging applications, delivering high yield, high throughput curing for wafers and panels. Both wafer and panel systems support vacuum curing and enable precise control in a high-volume production environment. Explore the full VertaCure lineup at https://xmrrwallet.com/cmx.pwww.yes.tech/ #AdvancedPackaging #SemiconductorEquipment #WaferProcessing #PanelLevelPackaging #ThermalProcessing #YES

The VertaCure family of tools are engineered to streamline and elevate advanced packaging applications, delivering high yield, high throughput curing for wafers and panels. Both wafer and panel systems support vacuum curing and enable precise control in a high-volume production environment. Explore the full VertaCure lineup at https://xmrrwallet.com/cmx.pwww.yes.tech/ #AdvancedPackaging #SemiconductorEquipment #WaferProcessing #PanelLevelPackaging #ThermalProcessing #YES

Glass Core vs. RDL Interposers: Ready for Prime-Time? IEEE ECTC, #ECTC, Given the critical role of high-density substrates in the semiconductor industry, glass-core substrates and RDL interposer advantages have been discussed. With growing demand of higher performance, larger devices, and increased interconnect density, where does each technology fit, what are the necessary steps to address the critical challenges faced by the entire industry? This session will address economic and technical perspectives for high volume solutions, including design, materials, process/equipment, and metrology to meet product needs and reliability requirements. The session will include a moderator and six panelists. Please join on Tuesday May 27 at 10:30am-12:00 noon.